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This review paper presents a comprehensive study of commonly used power amplifier (PA) structures. In recent years, with the development of modern wireless telecommunications and their dramatic challenges, new requirements are needed. In addition, some applications, like cell phones and tablets, for example, need new considerations, especially in terms of power consumption. Also, linearity is another major factor in designing a PA. Furthermore, fabrication technologies such as complementary metal-oxide semiconductors (CMOS), silicon on insulators (SOI), gallium nitride (GaN), gallium arsenide (GaAs), etc. play a crucial role in terms of power consumption. Therefore, it is necessary for PAs to meet these considerations. This paper reviews design considerations, fabrication technologies, and common PA structures, including envelope tracking (ET), envelope elimination and restoration (EER), Doherty, linear amplification with nonlinear components (LINC), feedback, and feedforward linearization techniques with their pros and cons. This review focuses on the significant achievements, techniques, structures, and characteristics of each. Also, this review focuses on the significant achievements, techniques, structures, and characteristics of each. Also, this paper tries to provide a brief overview of the various methods with the advantages and disadvantages of each. This review paper tries to make readers familiar with common structures so that readers know the advantages and disadvantages of each and choose the desired structure based on their priorities.

Keywords

power amplifier (PA); linearization technique; wireless telecommunication; envelope tracking (ET); envelope elimination and restoration (EER); Doherty; linear amplification with nonlinear components (LINC); feedback; feedforward; CMOS; SOI; GaN; GaAs

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